Brokerage for Lab to Fab Accelerator projects on Advanced Packaging

The brokerage will take place in conjunction with and hosted by the Fraunhofer IZM Electronic Packaging Days 2025. 
  
Chips JU will launch calls for Lab to Fab transfer of Advanced Packaging from the Chips JU pilot lines into industry. The goal of the workshop on November 7 is to inform the community about the call content and to initiate consortia building. 

Programme and registration here.