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- ECS SRIA 2023 - Amendment
- Chips JU - new Excutive Director
- Silicon Alps Peak Performer
- ESBS-Austria @IMAGINE23
- Chips JU as integral part of European Chips Act
- ESBS-Austria Conference: "Energy efficiency enabled by ESBS"
- ESBS-Austria@IMAGINE22 - Twin Transformation
- Young Academics - Winner's Awards 2022
- KDT and European Chips Act, 28 April 2022, Villach
- Growth, innovation and partnerships
- KDT Information Day Italy 2023
- Lab2Fab Semiconductor - Technology offensive for the semiconductor industry
- ECS SRIA 2023 - ONLINE VERSION AVAILABE!
- UltimateGaN – Enabler for green applications
- Successful Austrian IPCEI Day in Leoben
- ESBS-Austria Technical Position Paper 2023
- ESBS-Austria Conference: Sustainability and ESBS
- Members
- AIT Austrian Institute of Technology GmbH
- Alpen-Adria Universität Klagenfurt - Department of Smart Systems Technologies
- ams-OSRAM AG
- AT&S Austria Technologie & Systemtechnik AG
- AVL List GmbH
- Besi Austria GmbH
- CISC Semiconductor GmbH
- Department for Integrated Sensor Systems (DISS)
- TDK Electronics GmbH & Co OG
- EV Group Europe & Asia / Pacific GmbH
- Austrian Association for the Electrics and Electronics Industry (FEEI)
- FH Joanneum – Institute Electronic Engineering
- FH Technikum Wien
- Fronius International GmbH
- Infineon Technologies Austria AG
- Infineon Technologies Linz GmbH & Co KG
- Intel Austria GmbH
- Johannes Kepler University Linz
- Joanneum Research Forschungsgesellschaft mbH
- Kompetenzzentrum – Das Virtuelle Fahrzeug Forschungsgesellschaft mbH
- LAM Research AG
- Linz Center of Mechatronics GmbH
- Materials Center Leoben Forschungs GmbH
- Max Linear Austria GmbH
- Miba Energy Holding GmbH
- Mission Embedded GmbH
- NXP Semiconductors Austria GmbH & Co KG
- Plansee SE
- Polymer Competence Center Leoben GmbH
- Salzburg Research ForschungsgesellschaftmbH
- SBA Research gGmbH
- Siemens AG Österreich
- Silicon Austria Labs GmbH (SAL)
- Software Competence Center Hagenberg GmbH
- Transportation in Austria | Thales Group
- TTTech Computertechnik AG
- TU Wien - Institute for Mechanics and Mechatronics (MEC)
- TU Wien - Automation and Control Institute (ACIN)
- TU Wien - Institute of Electrodynamics, Microwave and Circuit (EMCE)
- TU Wien - Institute of Computer Engineering
- TU Graz - Institute of Microwave and Photonic Engineering
- TU Graz - Institute of Electrical Measurement and Measurement Signal Processing
- VRVis Zentrum für Virtual Reality und Visualisierung Forschungs-GmbH
- Events
- Austrian IPCEI Days
- Chips JU Launch Event
- Call 'Digital Technologies 2023' - Launch event
- EPoSS Annual Forum 2024
- Advanced Packaging and 3D Heterogeneous Integration for RF/mmWave Applications
- AI-assisted Methods and Tools for ECS Engineering Efficiency
- Chips JU as integral part of European Chips Act
- Silicon Austria Labs Symposium on 6G
- EBSCON 2023
- The Autonomous
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