Besi Austria GmbH

Besi Austria’s area of expertise is the development of leading-edge high-precision and high-flexibility assembly and die-handling equipment for flip-chip and multi-chip substrate and wafer-level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy, with 35 years of experience. Besi offers various machine platforms targeting different processes within the semiconductor packaging industry. Machines are designed with focus on modularity, flexibility and customization potential to be able to address technical challenges for highly advanced packaging processes, whilst still maintaining excellent yield, cost of ownership and time-to-market.

By combining the core business with new technologies and entering a next level in the value chain, AT&S is developing from a PCB manufacturer to an interconnect solution provider, thus creating a sustainable growth and positioning for future market opportunities. By providing innovative solutions, the company acts as enabler for future technologies like 5G networks, IoT, autonomous driving or artificial intelligence.

As a result, Besi is known throughout the worldwide semiconductor industry as one of the principal and most innovative providers of assembly and die-handling equipment, and as an essential research partner for several research institutes and industrial companies alike. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies.