Stakeholders across the European Electronic Components and Systems (ECS) community are invited to take part in the Chips JU upcoming Online Consultation Workshops as follows:
This interactive morning session will feature two dedicated topic consultations aimed at identifying industrial needs, closing technology gaps, and refining draft Call concepts for the Work Programme of 2027.
9:00-10:30h
Session 1: Co-Packaged Optics for Advanced Data Communication (IA)
Focusing on energy-efficient, high-throughput, and low-latency datalinks for AI and HPC infrastructure. Discussions will cover:
- Optical engine and transceiver integration
- Fiber-to-chip coupling & thermal management
- Test and reliability qualification for scale-up, scale-out, and optical circuit switching
10:30-12:00h
Session 2: System-Level Design for Heterogeneous Integration
Addressing critical system-level design gaps between now and 2030 to strengthen European technological sovereignty. Discussions will cover:
Early, holistic evaluation of complex architectures (security, flexibility, cost trade-offs)
Scalable abstraction from high-level exploration to subsystem refinement
Full traceability from architectural requirements to final decisions
Participants will have the opportunity to:
- Provide direct feedback on the ambition and relevance of draft call topics.
- Propose new ideas and highlight critical innovation gaps in Europe.
- Network with experts in photonics, packaging, and EDA methodologies.
More information and registration here.